multichip module
英 [ˌmʌltɪˈtʃɪp ˈmɒdjuːl]
美 [ˌmʌltiˈtʃɪp ˈmɑːdʒuːl]
网络 多芯片组件; 多芯片模块; 多晶片模块; 多晶片模組; 多芯片模型贴装
双语例句
- Three Dimensional Finite Element Analysis of Heat Dissipation of Multichip Module
多芯片组件散热的三维有限元分析 - This paper describes the features of LTCC three dimension Multichip module technology, and analyzes the development trend of LTCC 3D-MCM.
本文概述了低温共烧陶瓷（LTCC）三维多芯片组件技术的特点，并分析LTCC3D-MCM的发展趋势。 - As compared with traditional package technologies, multichip module ( MCM) technology has the higher packing densities and the more excellent characteristics.
与传统的封装技术相比，多芯片组装技术具有更高的封装密度和更优异的性能。 - Using multichip module ( MCM) technology, The theory and design for the two-channel millimeter wave front-end is present in this thesis.
所以进行本课题的研究就非常有实际意义。本文采用多芯片组件（MCM）技术对毫米波双通道接收前端进行了理论分析和设计，，并且进行了制作和测试。 - Technology of microwave multichip module
微波多芯片模块技术 - This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.
简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。 - Analysis of Interconnects in Multichip Module by Moment of Method
多芯片组件（MCM）中互连线系统的矩量法分析 - Analysis of Simultaneously Switching Noise on the Conductive Planes in Multichip Module ( MCM) with Partial Element Equivalent Circuit ( PEEC) Method
以PEEC方法分析MCM中导体板上同步开关噪声 - FEA Method in the Thermal Performance of Multichip Module
有限元热分析法在大功率多芯片组件中的应用 - Bonding interconnect is the critical technique for realizing the interconnect of microwave multichip module ( MCM). The height, distance and number of wires of bonding interconnect have important effects on its microwave characteristics.
键合互连是实现微波多芯片组件电气互连的关键技术，键合互连的拱高、跨距和金丝根数对其微波特性具有很大的影响。